Global X ETF Series II - Global X Asia Pacific High Dividend Yield ETF
2549005ZQDMV3WNUF542
issued
Company data
| Legal name | Global X ETF Series II - Global X Asia Pacific High Dividend Yield ETF |
| Legal address | Room 1101, 11/F, Lee Garden Three, 1 Sunning Road, Hong Kong, 999077, Hong Kong |
| Registration authority entity ID | BSL575 |
| Entity status |
Active
|
LEI registration details
| LEI code | 2549005ZQDMV3WNUF542 |
| Status |
Issued
|
| Next renewal date | 2025-04-01 |
| Managing LOU | Bloomberg Finance L.P. |
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Company data
| Legal name | Global X ETF Series II - Global X Asia Pacific High Dividend Yield ETF |
| Entity status |
Active
|
| Registered at | Securities and Futures Commission Hong Kong, Hong Kong RA000390 |
| Registration authority entity ID | BSL575 |
| Legal jurisdiction | HK |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2022-07-05 |
| Validated At | Securities and Futures Commission Hong Kong, Hong Kong RA000390 |
| Validated As | BSL575 |
LEI registration details
| LEI code | 2549005ZQDMV3WNUF542 |
| Status |
Issued
|
| Initial registration | 2022-06-01 |
| Last update | 2024-03-21 |
| Next renewal date | 2025-04-01 |
| Managing LOU | Bloomberg Finance L.P. |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | Room 1101, 11/F, Lee Garden Three, 1 Sunning Road |
| Postal code | 999077 |
| City | Hong Kong |
| Country | HK | Hong Kong |
Headquarters address
| Headquarters address | C/O Mirae Asset Global Investments (Hong Kong) Limited, Room 1101, 11/F, Lee Garden Three, 1 Sunning Road |
| Postal code | 999077 |
| City | Hong Kong |
| Country | HK | Hong Kong |
Parents
|
NON_CONSOLIDATING (Direct parent exception reported) NON_CONSOLIDATING (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
Umbrella Fund
Global X Asia Pacific High Dividend Yield ETF
LEI: 2549005ZQDMV3WNUF542
LEI registration status: ISSUED
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Global X Asia Pacific High Dividend Yield ETF
LEI: 2549005ZQDMV3WNUF542
LEI registration status: ISSUED
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