The Future Fund, LLC
2549007JSCZKMP1OFD20
issued
Company data
| Legal name | The Future Fund, LLC |
| Legal address | C/O Illinois Corporation Service Company, 801 Adlai Stevenson Drive, Springfield, 62703, United States of America |
| Registration authority entity ID | 09480382 |
| Entity status |
Active
|
LEI registration details
| LEI code | 2549007JSCZKMP1OFD20 |
| Status |
Issued
|
| Next renewal date | 2025-10-10 |
| Managing LOU | Bloomberg Finance L.P. |
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Company data
| Legal name | The Future Fund, LLC |
| Entity status |
Active
|
| Registered at | Business Services (Office of the Secretary of State) United States of America, Illinois RA000608 |
| Registration authority entity ID | 09480382 |
| Legal jurisdiction | US-IL |
| Entity category | GENERAL |
| Entity legal form code | Limited Liability Company (en) 8RLE |
| Entity created at | 2021-03-16 |
| Validated At | Business Services (Office of the Secretary of State) United States of America, Illinois RA000608 |
| Validated As | 09480382 |
LEI registration details
| LEI code | 2549007JSCZKMP1OFD20 |
| Status |
Issued
|
| Initial registration | 2023-10-09 |
| Last update | 2024-10-10 |
| Next renewal date | 2025-10-10 |
| Managing LOU | Bloomberg Finance L.P. |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | C/O Illinois Corporation Service Company, 801 Adlai Stevenson Drive |
| Postal code | 62703 |
| City | Springfield |
| Region code | US-IL |
| Country | US | United States of America |
Headquarters address
| Headquarters address | 330 N. Wabash, Suite 2300 |
| Postal code | 60611 |
| City | Chicago |
| Region code | US-IL |
| Country | US | United States of America |
Parents
|
NON_CONSOLIDATING (Direct parent exception reported) NON_CONSOLIDATING (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Managed Funds
The Future Fund, LLC
LEI: 2549007JSCZKMP1OFD20
LEI registration status: ISSUED
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The Future Fund, LLC
LEI: 2549007JSCZKMP1OFD20
LEI registration status: ISSUED
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