Corbin TLP Fund II, L.P.
254900F4NVM00DHPEZ30
issued
Company data
| Legal name | Corbin TLP Fund II, L.P. |
| Legal address | C/O THE CORPORATION TRUST COMPANY, CORPORATION TRUST CENTER, 1209 ORANGE ST, WILMINGTON, 19801, United States of America |
| Registration authority entity ID | 0002010333 |
| Entity status |
Active
|
LEI registration details
| LEI code | 254900F4NVM00DHPEZ30 |
| Status |
Issued
|
| Next renewal date | 2025-12-04 |
| Managing LOU | Bloomberg Finance L.P. |
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Company data
| Legal name | Corbin TLP Fund II, L.P. |
| Entity status |
Active
|
| Registered at | EDGAR (Securities and Exchange Commission) Guam, Guam RA000665 |
| Registration authority entity ID | 0002010333 |
| Legal jurisdiction | US |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2023-11-21 |
| Validated At | EDGAR (Securities and Exchange Commission) Guam, Guam RA000665 |
| Validated As | 0002010333 |
LEI registration details
| LEI code | 254900F4NVM00DHPEZ30 |
| Status |
Issued
|
| Initial registration | 2024-01-04 |
| Last update | 2024-11-26 |
| Next renewal date | 2025-12-04 |
| Managing LOU | Bloomberg Finance L.P. |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | C/O THE CORPORATION TRUST COMPANY, CORPORATION TRUST CENTER, 1209 ORANGE ST |
| Postal code | 19801 |
| City | WILMINGTON |
| Region code | US-DE |
| Country | US | United States of America |
Headquarters address
| Headquarters address | C/O CORBIN CAPITAL PARTNERS, L.P., 575 Madison Avenue, 21st Floor |
| Postal code | 10022 |
| City | New York |
| Region code | US-NY |
| Country | US | United States of America |
Parents
|
NON_CONSOLIDATING (Direct parent exception reported) NON_CONSOLIDATING (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
Corbin TLP Fund II, L.P.
LEI: 254900F4NVM00DHPEZ30
LEI registration status: ISSUED
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Corbin TLP Fund II, L.P.
LEI: 254900F4NVM00DHPEZ30
LEI registration status: ISSUED
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