ABRDN OEIC II - ABRDN STERLING CORPORATE BOND FUND
5493002044GBSUYXHY38
issued
Company data
| Legal name | ABRDN OEIC II - ABRDN STERLING CORPORATE BOND FUND |
| Legal address | C/O ABRDN FUND MANAGERS LIMITED, 280 BISHOPSGATE, LONDON, EC2M 4AG, United Kingdom |
| Registration authority entity ID | 722845 |
| Entity status |
Active
|
LEI registration details
| LEI code | 5493002044GBSUYXHY38 |
| Status |
Issued
|
| Next renewal date | 2025-10-28 |
| Managing LOU | LONDON STOCK EXCHANGE LEI LIMITED |
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Company data
| Legal name | ABRDN OEIC II - ABRDN STERLING CORPORATE BOND FUND |
| Entity status |
Active
|
| Other entity names | ASI (SLI) CORPORATE BOND FUND STANDARD LIFE INVESTMENT COMPANY - CORPORATE BOND FUND |
| Registered at | Financial Services Register (Financial Conduct Authority) United Kingdom, United Kingdom RA000592 |
| Registration authority entity ID | 722845 |
| Legal jurisdiction | GB |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2015-10-23 |
| Validated At | Financial Services Register (Financial Conduct Authority) United Kingdom, United Kingdom RA000592 |
| Validated As | 722845 |
LEI registration details
| LEI code | 5493002044GBSUYXHY38 |
| Status |
Issued
|
| Initial registration | 2015-10-10 |
| Last update | 2024-08-29 |
| Next renewal date | 2025-10-28 |
| Managing LOU | LONDON STOCK EXCHANGE LEI LIMITED |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | C/O ABRDN FUND MANAGERS LIMITED, 280 BISHOPSGATE |
| Postal code | EC2M 4AG |
| City | LONDON |
| Region code | GB-LND |
| Country | GB | United Kingdom |
Headquarters address
| Headquarters address | C/O ABRDN FUND MANAGERS LIMITED, 280 BISHOPSGATE |
| Postal code | EC2M 4AG |
| City | LONDON |
| Region code | GB-LND |
| Country | GB | United Kingdom |
Parents
|
ABRDN OEIC II (Direct parent) ABRDN PLC (Ultimate Parent) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
Umbrella Fund
ABRDN STERLING CORPORATE BOND FUND
LEI: 5493002044GBSUYXHY38
LEI registration status: ISSUED
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ABRDN STERLING CORPORATE BOND FUND
LEI: 5493002044GBSUYXHY38
LEI registration status: ISSUED
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