JPMORGAN FUND ICVC - JPM STERLING CORPORATE BOND FUND
549300G6AFLCVYHY8P11
issued
Company data
| Legal name | JPMORGAN FUND ICVC - JPM STERLING CORPORATE BOND FUND |
| Legal address | 60 Victoria Embankment, London, EC4Y 0JP, United Kingdom |
| Registration authority entity ID | 636385 |
| Entity status |
Active
|
LEI registration details
| LEI code | 549300G6AFLCVYHY8P11 |
| Status |
Issued
|
| Next renewal date | 2025-09-12 |
| Managing LOU | Ubisecure Oy |
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Company data
| Legal name | JPMORGAN FUND ICVC - JPM STERLING CORPORATE BOND FUND |
| Entity status |
Active
|
| Other entity names | JPM UK BOND FUND |
| Registered at | Financial Services Register (Financial Conduct Authority) United Kingdom, United Kingdom RA000592 |
| Registration authority entity ID | 636385 |
| Legal jurisdiction | GB |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2001-10-18 |
| Validated At | Financial Services Register (Financial Conduct Authority) United Kingdom, United Kingdom RA000592 |
| Validated As | 636385 |
LEI registration details
| LEI code | 549300G6AFLCVYHY8P11 |
| Status |
Issued
|
| Initial registration | 2012-12-07 |
| Last update | 2024-08-22 |
| Next renewal date | 2025-09-12 |
| Managing LOU | Ubisecure Oy |
| Validation sources | PARTIALLY_CORROBORATED |
Legal address
| Legal address | 60 Victoria Embankment |
| Postal code | EC4Y 0JP |
| City | London |
| Region code | GB-LND |
| Country | GB | United Kingdom |
Headquarters address
| Headquarters address | c/o JPMORGAN FUNDS LIMITED 3 Lochside View, Edinburgh Park |
| Postal code | EH12 9DH |
| City | Edinburgh |
| Region code | GB-EDH |
| Country | GB | United Kingdom |
Parents
|
NO_KNOWN_PERSON (Direct parent exception reported) NO_KNOWN_PERSON (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
Umbrella Fund
JPM STERLING CORPORATE BOND FUND
LEI: 549300G6AFLCVYHY8P11
LEI registration status: ISSUED
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JPM STERLING CORPORATE BOND FUND
LEI: 549300G6AFLCVYHY8P11
LEI registration status: ISSUED
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