Invesco Trust Series - Invesco Asian Bond Fixed Maturity Fund 2024
549300HJ4RQZBZRUAL88
issued
Company data
| Legal name | Invesco Trust Series - Invesco Asian Bond Fixed Maturity Fund 2024 |
| Legal address | 41st Floor, Champion Tower, Central and Western District, HONG KONG, 999077, Hong Kong |
| Registration authority entity ID | BPX603 |
| Entity status |
Active
|
LEI registration details
| LEI code | 549300HJ4RQZBZRUAL88 |
| Status |
Issued
|
| Next renewal date | 2025-01-06 |
| Managing LOU | Bloomberg Finance L.P. |
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Company data
| Legal name | Invesco Trust Series - Invesco Asian Bond Fixed Maturity Fund 2024 |
| Entity status |
Active
|
| Registered at | Securities and Futures Commission Hong Kong, Hong Kong RA000390 |
| Registration authority entity ID | BPX603 |
| Legal jurisdiction | HK |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2020-11-11 |
| Validated At | Securities and Futures Commission Hong Kong, Hong Kong RA000390 |
| Validated As | BPX603 |
LEI registration details
| LEI code | 549300HJ4RQZBZRUAL88 |
| Status |
Issued
|
| Initial registration | 2020-12-08 |
| Last update | 2024-09-07 |
| Next renewal date | 2025-01-06 |
| Managing LOU | Bloomberg Finance L.P. |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | 41st Floor, Champion Tower, Central and Western District |
| Postal code | 999077 |
| City | HONG KONG |
| Country | HK | Hong Kong |
Headquarters address
| Headquarters address | C/O 1331 Spring Street NW, Suite 2500 |
| Postal code | 30309 |
| City | Atlanta |
| Region code | US-GA |
| Country | US | United States of America |
Parents
|
NON_CONSOLIDATING (Direct parent exception reported) NON_CONSOLIDATING (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
Umbrella Fund
Invesco Asian Bond Fixed Maturity Fund 2024
LEI: 549300HJ4RQZBZRUAL88
LEI registration status: ISSUED
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Invesco Asian Bond Fixed Maturity Fund 2024
LEI: 549300HJ4RQZBZRUAL88
LEI registration status: ISSUED
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