JPMorgan SAR Investment Grade Corporate Bond Fund
549300QNAHY4R8B2U235
issued
Company data
| Legal name | JPMorgan SAR Investment Grade Corporate Bond Fund |
| Legal address | c/o JPMorgan Asset Management (Asia Pacific) Limited 19/F, CHATER HOUSE 8 CONNAUGHT ROAD, CENTRAL, HONG KONG, , Hong Kong |
| Registration authority entity ID | BPK264 |
| Entity status |
Active
|
LEI registration details
| LEI code | 549300QNAHY4R8B2U235 |
| Status |
Issued
|
| Next renewal date | 2025-05-20 |
| Managing LOU | Ubisecure Oy |
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Company data
| Legal name | JPMorgan SAR Investment Grade Corporate Bond Fund |
| Entity status |
Active
|
| Registered at | Securities and Futures Commission Hong Kong, Hong Kong RA000390 |
| Registration authority entity ID | BPK264 |
| Legal jurisdiction | HK |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2020-11-17 |
| Validated At | Securities and Futures Commission Hong Kong, Hong Kong RA000390 |
| Validated As | BPK264 |
LEI registration details
| LEI code | 549300QNAHY4R8B2U235 |
| Status |
Issued
|
| Initial registration | 2020-06-15 |
| Last update | 2024-04-10 |
| Next renewal date | 2025-05-20 |
| Managing LOU | Ubisecure Oy |
| Validation sources | PARTIALLY_CORROBORATED |
Legal address
| Legal address | c/o JPMorgan Asset Management (Asia Pacific) Limited 19/F, CHATER HOUSE 8 CONNAUGHT ROAD, CENTRAL |
| City | HONG KONG |
| Country | HK | Hong Kong |
Headquarters address
| Headquarters address | c/o JPMorgan Asset Management (Asia Pacific) Limited 19/F, CHATER HOUSE 8 CONNAUGHT ROAD, CENTRAL |
| City | HONG KONG |
| Country | HK | Hong Kong |
Parents
|
NON_CONSOLIDATING (Direct parent exception reported) NON_CONSOLIDATING (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
JPMorgan SAR Investment Grade Corporate Bond Fund
LEI: 549300QNAHY4R8B2U235
LEI registration status: ISSUED
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JPMorgan SAR Investment Grade Corporate Bond Fund
LEI: 549300QNAHY4R8B2U235
LEI registration status: ISSUED
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