JPMorgan Core Plus Bond Fund
JW89OQCNJOLWVS3KT374
issued
Company data
| Legal name | JPMorgan Core Plus Bond Fund |
| Legal address | C/O THE CORPORATION TRUST COMPANY, CORPORATION TRUST CENTER, 1209 ORANGE ST, WILMINGTON, 19801, United States of America |
| Registration authority entity ID | S000003478 |
| Entity status |
Active
|
LEI registration details
| LEI code | JW89OQCNJOLWVS3KT374 |
| Status |
Issued
|
| Next renewal date | 2025-09-08 |
| Managing LOU | Bloomberg Finance L.P. |
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Company data
| Legal name | JPMorgan Core Plus Bond Fund |
| Entity status |
Active
|
| Registered at | EDGAR (Securities and Exchange Commission) Guam, Guam RA000665 |
| Registration authority entity ID | S000003478 |
| Legal jurisdiction | US |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2012-06-05 |
| Validated At | EDGAR (Securities and Exchange Commission) Guam, Guam RA000665 |
| Validated As | S000003478 |
LEI registration details
| LEI code | JW89OQCNJOLWVS3KT374 |
| Status |
Issued
|
| Initial registration | 2012-06-06 |
| Last update | 2024-09-05 |
| Next renewal date | 2025-09-08 |
| Managing LOU | Bloomberg Finance L.P. |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | C/O THE CORPORATION TRUST COMPANY, CORPORATION TRUST CENTER, 1209 ORANGE ST |
| Postal code | 19801 |
| City | WILMINGTON |
| Region code | US-DE |
| Country | US | United States of America |
Headquarters address
| Headquarters address | C/O J.P. MORGAN INVESTMENT MANAGEMENT INC., 270 PARK AVENUE |
| Postal code | 10017 |
| City | NEW YORK |
| Region code | US-NY |
| Country | US | United States of America |
Parents
|
NON_CONSOLIDATING (Direct parent exception reported) NON_CONSOLIDATING (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
Umbrella Fund
JPMorgan Core Plus Bond Fund
LEI: JW89OQCNJOLWVS3KT374
LEI registration status: ISSUED
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JPMorgan Core Plus Bond Fund
LEI: JW89OQCNJOLWVS3KT374
LEI registration status: ISSUED
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